Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders
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DOI: 10.1007/s11664-018-6786-4
Abstract: Printed circuit boards that use fine pitch technology have a greater risk of open-circuit failure, due to void formations caused by the growth of intermetallic compounds. This failure mode is reported to be a result… read more here.
Keywords: imc growth; electromigration; intermetallic compounds; thermomigration ... See more keywords
Kinetics of thin film intermetallic compound formation in the Cu/SnxIn100-x system characterized using color change observations
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DOI: 10.1016/j.jallcom.2017.10.106
Abstract: Abstract A high-throughput technique is developed to investigate intermetallic compound (IMC) growth kinetics in Cu/Sn and Cu/SnxIn100-x bilayer systems based on combinatorial deposition of solder thin films and observation of color changes. A model for… read more here.
Keywords: imc growth; color; system; intermetallic compound ... See more keywords
Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate
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DOI: 10.1016/j.vacuum.2018.10.024
Abstract: Abstract This paper described microstructure evolution of interfacial intermetallic compound (IMC) layers in a series of Sn-37Pb/Cu-Co systems (the different amount of Co additions was a variable in this experiment, and we represented it with… read more here.
Keywords: interfacial reaction; imc; imc growth; reaction imc ... See more keywords