Effects of thermal aging on growth behavior of interfacial intermetallic compound of dip soldered Sn/Cu joints
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-8904-8
Abstract: Intermetallic compounds (IMCs) formations of Sn/Cu reaction couple prepared by dip soldering were studied with isothermal aging at four levels of temperatures (120, 150, 170 and 200 °C, respectively). It is found that an obvious scallop-type… read more here.
Keywords: imc layer; dip; aging time; growth ... See more keywords
Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2019.151714
Abstract: Abstract In this study, the effect of multi-walled carbon nanotubes (MWCNTs) reinforcement on the intermetallic compound (IMC) layer growth and shear strength of Sn–5Sb-xCNT/Cu composite solder joints subjected to different isothermal aging conditions has been… read more here.
Keywords: growth; isothermal aging; solder; imc layer ... See more keywords
Laser welding of steel to aluminium : thermal modelling and joint strength analysis
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Processing Technology"
DOI: 10.1016/j.jmatprotec.2017.04.002
Abstract: The integrity of steel-aluminium dissimilar alloy joints is dependent on the thermal cycle applied during the joining process. The thermal field has a direct influence on the growth of the intermetallic compounds (IMC), which result… read more here.
Keywords: strength; aluminium; bonding area; imc layer ... See more keywords
Cu-Cu low temperature bonding based on lead-free solder with graphene interlayer
Sign Up to like & getrecommendations! Published in 2019 at "Applied Physics Letters"
DOI: 10.1063/1.5116615
Abstract: In order to suppress the immoderate growth of intermetallic compounds (IMCs) at the Sn-Cu bonding interface, we transferred multilayer graphene between the Sn solder and the Cu film sample as an interlayer. Then, an external… read more here.
Keywords: graphene; imc layer; graphene interlayer; interface ... See more keywords
Microstructure, interfacial IMC layer and mechanical properties of Cu/Sn-9Zn-xZrC/Cu solder joints
Sign Up to like & getrecommendations! Published in 2018 at "Materials Research Express"
DOI: 10.1088/2053-1591/aacd97
Abstract: The effect of trace ZrC on the wettability, microstructure and mechanical properties of Sn-9Zn composite solder alloy joints was investigated. The results indicated that the wettability of the Sn-9Zn based composite solder alloy was improved… read more here.
Keywords: composite solder; solder joints; imc layer; mechanical properties ... See more keywords