Impact of the Bonding Sites at the Inner or Outer π-Bridged Positions for Non-Fullerene Acceptors.
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DOI: 10.1021/acsami.9b02964
Abstract: Two A-π-D-π-A-type non-fullerene acceptors (IDT-ToFIC and IDT-TiFIC) with 5-hexylthienyl chains substituted at the inner and outer β-positions of the thiophene π-bridge have been designed, respectively. Impacts of varied positional modifications are systematically studied. By utilizing… read more here.
Keywords: non fullerene; impact bonding; sites inner; fullerene acceptors ... See more keywords
Impact of Bonding Pressure on the Reactive Bonding of LTCC Substrates
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DOI: 10.3390/mi16030321
Abstract: Reactive bonding can overcome the issues associated with conventional soldering processes, such as potential damage to heat-sensitive components and the creation of thermomechanical stress due to differing coefficients of thermal expansion. The risk of such… read more here.
Keywords: pressure; reactive bonding; bonding pressure; impact bonding ... See more keywords