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Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.3010064
Abstract: The void in the solder layer is one of the most important aging forms of the insulated-gate bipolar transistor (IGBT) module. In this article, the influence mechanism of different void fractions on the thermal conductivity…
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Keywords:
improved cauer;
layer;
cauer model;
solder layer ... See more keywords