LAUSR

Improving sidewall roughness by combined RIE-Bosch process

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1 Published in 2018 at "Materials Science in Semiconductor Processing"

DOI: 10.1016/j.mssp.2018.04.033

Abstract: Abstract An approach for improving sidewall roughness of high-aspect-ratio trench is developed. This method relies on the aspect ratio dependent scalloping attenuation (ARDSA) effect in Bosch process, employs reactive ion etching (RIE) process to avoid… read more here.

Keywords: improving sidewall; process; sidewall roughness; bosch process ... See more keywords