Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices
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DOI: 10.1364/ome.7.004408
Abstract: Heterogeneous integration of InP devices to Si substrates by adhesive-less micro transfer printing requires flat surfaces for optimum attachment and thermal sinking. InGaAs and InAlAs sacrificial layers are compared for the selective undercut of InP… read more here.
Keywords: ingaas inalas; sacrificial layers; release inp; layers release ... See more keywords