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Published in 2020 at "Surface and Interface Analysis"
DOI: 10.1002/sia.6857
Abstract: During high‐electron‐mobility transistor elaboration process, a thermal treatment of In0.2Al0.8N (InAlN) barrier layer is performed in order to improve electrical performances. We showed previously that In0.2Al0.8N/GaN heterostructures, annealed at 850°C under O2 partial pressure, present…
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Keywords:
ray photoelectron;
depth;
angle resolved;
resolved ray ... See more keywords
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1
Published in 2021 at "Optical and Quantum Electronics"
DOI: 10.1007/s11082-021-02786-2
Abstract: This paper proposes a novel normally-off p-GaN gate InAlN/GaN HEMT to replace p-GaN gate AlGaN/GaN HEMT for improving the device stability, enhancing saturation current, reducing the on-state resistance, improving the cut off frequency and decreasing…
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Keywords:
gan gate;
inaln;
electron;
layer ... See more keywords
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1
Published in 2020 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2019.144086
Abstract: Abstract InAlN as a functional inorganic material is a promising alternative to the commonly used InGaN in tunnel diodes and optoelectronic devices, due to its tunable wider range of energy bandgap (0.65–6.2 eV), thus empowering utilization…
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Keywords:
inaln;
sapphire;
rich inaln;
layer ... See more keywords
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Published in 2024 at "Semiconductor Science and Technology"
DOI: 10.1088/1361-6641/ad4a2d
Abstract: In this paper, the impact of upper channel layer thickness on the electrical characteristics and hysteresis behavior of double-channel InAlN/GaN HEMTs were investigated. The devices with an upper channel layer thickness of 20 nm exhibit…
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Keywords:
layer;
double channel;
inaln;
upper channel ... See more keywords