Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding
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DOI: 10.1007/s10854-020-04824-3
Abstract: For the advanced 3D-IC or 3D-packaging application, Cu-core solder joint is already a high reliability option for high power device and 3D packaging. However, with the harsher requirement for mechanical and electromigration reliability, it is… read more here.
Keywords: strength; increasing mechanical; solder joints; solder ... See more keywords