Soldering porous ceramics through ultrasonic-induced capillary action and cavitation
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DOI: 10.1016/j.ceramint.2019.01.171
Abstract: Abstract An ultrasonic-induced capillary action method was used to join porous ceramics for the first time. Results indicated that under ultrasonication, the solder infiltrated the porous ceramics and formed a soldered joint. The solder infiltration… read more here.
Keywords: induced capillary; porous ceramics; ultrasonic induced; capillary action ... See more keywords