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Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-8328-x
Abstract: During operation of high power electronic chips the topside metallization is subjected to cyclic compressive and tensile stresses leading to unwanted thermo-mechanical fatigue of the metallization layer. The stress is caused by the difference in…
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Keywords:
thermo mechanically;
evolution;
induced texture;
texture ... See more keywords