The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films
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DOI: 10.1016/j.tsf.2016.11.047
Abstract: In this work we studied the impact of pulse electroplating parameters on the cross-sectional and surface microstructures of blanket copper films using electron backscattering diffraction and x-ray diffraction. The films evaluated were highly (111) textured… read more here.
Keywords: pulse plating; copper; influence pulse; stress ... See more keywords
Influence of pulse operational parameters on pure nickel electrodeposits: Part II. Microhardness and corrosion resistance
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DOI: 10.1080/02670844.2015.1122140
Abstract: Nanocrystalline nickel electrodeposits were fabricated from an additive-free Watts bath by pulse current electrodeposition technique. The coatings were obtained at different current densities, duty cycles and pulse frequencies and were characterised using Field Emission Scanning… read more here.
Keywords: microhardness; nickel electrodeposits; influence pulse; corrosion ... See more keywords
Influence of Pulse Operational Parameters on Electrodeposition, Morphology and Microstructure of Ni/nanodiamond Composite Coatings
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DOI: 10.20964/2017.05.52
Abstract: Nickel and Nickel-nanodiamond coatings have been successfully electrodeposited on copper substrates by the pulse plating method. The variables investigated within this work include the current density, pulse frequency, bath temperature, duty cycle and nanodiamond concentration… read more here.
Keywords: operational parameters; influence pulse; nanodiamond; preferred orientation ... See more keywords