Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates
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DOI: 10.1016/j.jallcom.2017.01.109
Abstract: Abstract An effective method for inhibiting the growth of interfacial intermetallic compounds during solid-state aging has been proposed in this study. Pre-tinned Cu substrates containing oriented interfacial Cu 6 Sn 5 grains were prepared and… read more here.
Keywords: inhibition interfacial; growth inhibition; intermetallic compounds; interfacial intermetallic ... See more keywords