Thermal stress analysis of InSb IRPFAs assembled in Dewar
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DOI: 10.1007/s11082-020-02386-6
Abstract: Thermal stress accumulated in InSb infrared focal plane arrays (IRFPAs) during liquid nitrogen shock tests usually gives rise to brittle fracture of InSb chips, local delamination between InSb chips and underfill. Upon the specific structure… read more here.
Keywords: thermal stress; fixed mode; insb; surface ... See more keywords