In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate
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DOI: 10.1016/j.electacta.2019.135358
Abstract: Abstract Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between… read more here.
Keywords: seed layer; seed; composite film; insulating substrate ... See more keywords