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Published in 2019 at "IEEE Journal of Selected Topics in Quantum Electronics"
DOI: 10.1109/jstqe.2018.2879018
Abstract: Improving the scalability and cost efficiency of photonic packaging is central to fulfilling the silicon photonic promise of low-cost devices with unprecedented optical complexity. A key enabler toward this goal is an efficient, large-mode, integrated…
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Keywords:
integrated metamaterial;
self aligned;
fiber chip;
chip ... See more keywords