Failure and failure characterization of QFP package interconnect structure under random vibration condition
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DOI: 10.1016/j.microrel.2018.08.011
Abstract: Abstract Electronics installed in modern complex systems, like automotive and aircraft systems, are mainly subjected to mechanical vibrations in applications. The interconnection structure, as the mechanical fixing and electrical interconnection between the electrical device and… read more here.
Keywords: interconnect structure; failure; random vibration; structure ... See more keywords