Electrical and Morphological Characterizations of 3-D Interconnections for Quantum Computation
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DOI: 10.1109/tcpmt.2021.3104326
Abstract: Large-scale integration of quantum bits (qubits) requires 3-D architectures functional at sub-Kelvin temperatures. Electrical signals are transferred through 3-D interconnects to control and read out the information stored in the qubits. Careful design of the… read more here.
Keywords: interconnections quantum; quantum computation; morphological characterizations; characterizations interconnections ... See more keywords