Robust tuning of Kirkendall void density in circuit interconnections through substrate strain annealing
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DOI: 10.1007/s10854-018-8837-2
Abstract: Unpredictable Kirkendall void formation at the interface of circuit interconnections underlies degradation in electronics, yet there is a lack of effective approaches to curb the amount of these voids. In this paper, we developed a… read more here.
Keywords: interconnections substrate; circuit interconnections; circuit; void density ... See more keywords