Articles with "interface materials" as a keyword



Soft and Self‐Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling

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Published in 2021 at "Advanced Functional Materials"

DOI: 10.1002/adfm.202104062

Abstract: Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials (TIMs) is a growing demand to… read more here.

Keywords: aligned covalently; thermal interface; covalently bonded; interface materials ... See more keywords

Covalently Functionalized Leakage-Free Healable Phase Change Interface Materials with Extraordinary High Thermal Conductivity and Low Thermal Resistance.

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Published in 2023 at "Advanced materials"

DOI: 10.1002/adma.202300956

Abstract: Phase change material (PCM) has received considerable attention to take advantage of both pad-type and grease-type thermal interface materials (TIMs). However, the fatal drawbacks of leaking, non-recyclability, and low thermal conductivity (κ) hinder industrial applications… read more here.

Keywords: interface materials; phase change; low thermal; phase ... See more keywords

Chloroform‐Assisted Rapid Growth of Vertical Graphene Array and Its Application in Thermal Interface Materials

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Published in 2022 at "Advanced Science"

DOI: 10.1002/advs.202200737

Abstract: With the continuous progress in electronic devices, thermal interface materials (TIMs) are urgently needed for the fabrication of integrated circuits with high reliability and performance. Graphene as a wonderful additive is often added into polymer… read more here.

Keywords: interface materials; graphene; rapid growth; growth ... See more keywords

Thermal Interface Materials With Excellent Flexibility and Adhesion via Chain Segment Structure Design

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Published in 2025 at "Polymer Composites"

DOI: 10.1002/pc.70140

Abstract: Effective heat dissipation is essential for optimizing the performance and extending the service life of electronic devices. However, developing thermal interface materials (TIMs) that integrate excellent stretchability, self‐adhesiveness, and high thermal conductivity still represents a… read more here.

Keywords: structure; interface materials; thermal interface; thermal conductivity ... See more keywords

High Thermal Conductivity of Sandwich-Structured Flexible Thermal Interface Materials.

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Published in 2023 at "Small"

DOI: 10.1002/smll.202207015

Abstract: Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition… read more here.

Keywords: interface materials; sandwich; sandwich structured; high thermal ... See more keywords

Spherical core-shell Al@Al2O3 filled epoxy resin composites as high-performance thermal interface materials

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Published in 2019 at "Composites Part A: Applied Science and Manufacturing"

DOI: 10.1016/j.compositesa.2019.05.024

Abstract: Abstract With the miniaturization, high power density, and high integration of modern electronics, heat accumulation has emerged as a critical issue that affects their performance and reliability. The application of thermal interface materials is a… read more here.

Keywords: epoxy resin; thermal interface; performance; shell ... See more keywords
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Microstructure design and analysis of thermal interface materials using high heat- resistance natural fibers

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Published in 2021 at "Journal of Industrial and Engineering Chemistry"

DOI: 10.1016/j.jiec.2021.06.003

Abstract: Abstract This study indicates the importance of structure optimization and analysis for investigating direct screen-printed pastes of carbon based microstructures for use in flexible thermal interface material (TIM). The basalt fiber that is used as… read more here.

Keywords: thermal interface; interface; basalt particles; interface materials ... See more keywords

Low Contact Thermal Resistance without Packaging Pressure in Highly Thermally Conductive Interface Materials Enabled by Polysulfide Vitrimer.

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Published in 2025 at "Nano letters"

DOI: 10.1021/acs.nanolett.5c04315

Abstract: Thermal interface materials (TIMs) are essential for enhancing interfacial heat transfer, yet achieving both high through-plane thermal conductivity (κ⊥) and structural conformability remains difficult. This study introduces a vitrimer-based TIM using a diglycidyl-ether end-capped liquid… read more here.

Keywords: pressure; thermal resistance; interface materials; contact thermal ... See more keywords

General Approach to Hydrolysis Resistive Aluminum Nitride and Its High-Performance Thermal Interface Materials.

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Published in 2024 at "ACS applied materials & interfaces"

DOI: 10.1021/acsami.4c14916

Abstract: Aluminum nitride (AlN), noted for its excellent thermal conductivity and exceptional electrical insulation, presents a promising alternative to traditional ceramic particles in thermal interface materials (TIMs). However, its broader adoption in practical applications is limited… read more here.

Keywords: interface materials; thermal interface; performance; aluminum nitride ... See more keywords

Silicon Carbide-Welded Boron Nitride Networks for Self-Healing Flexible Thermal Interface Materials.

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Published in 2025 at "ACS applied materials & interfaces"

DOI: 10.1021/acsami.5c16186

Abstract: Boron nitride (BN) as fillers for thermal interface materials (TIMs) has attracted great attention due to its high thermal conductivity (TC) and electrical insulation. The carbon-welding strategy is demonstrated to be effective for lowering the… read more here.

Keywords: boron nitride; silicon carbide; interface materials; thermal interface ... See more keywords

Magnesium-induced preparation of boron nitride nanotubes and their application in thermal interface materials.

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Published in 2019 at "Nanoscale"

DOI: 10.1039/c9nr03915e

Abstract: The effective growth of boron nitride nanotubes (BNNTs) by boron oxide chemical vapor deposition (BOCVD) is extremely challenging, especially in a horizontal tube furnace. Herein, we propose a novel Mg-induction strategy, which is low cost… read more here.

Keywords: thermal interface; boron nitride; interface materials; nitride nanotubes ... See more keywords