Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance
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DOI: 10.1080/01495739.2018.1525331
Abstract: Abstract Application of the concept of interfacial compliance in analytical thermal stress modeling in electronics and photonics engineering is addressed. The review is based mostly on the author’s research conducted during his tenure with Bell… read more here.
Keywords: concept interfacial; thermal stress; interfacial compliance; application concept ... See more keywords