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Published in 2020 at "Advanced Materials Interfaces"
DOI: 10.1002/admi.201902046
Abstract: Particle moving is a fundamental phenomenon of colloidal nanoparticles (NPs), but its influence on the interfacial interaction is far from been clarified. Herein, by mimicking the particle moving of upconverting fluoride NPs in a flowing…
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Keywords:
interfacial reactions;
frequency generation;
situ sum;
particle moving ... See more keywords
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Published in 2021 at "Advanced Energy Materials"
DOI: 10.1002/aenm.202101490
Abstract: Interphases, solid‐electrolyte interphase (SEI), and cathode‐electrolyte interphase (CEI) are the key influencers in determining battery life and performance. Especially, for technologies such as sodium‐ion batteries that are in the development stage, it is crucial to…
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Keywords:
chemistry;
interfacial reactions;
interphase chemistry;
tune interphase ... See more keywords
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Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7647-2
Abstract: The interfacial microstructures between Zn–Sn solder alloys and Cu substrate were investigated, and the effect of rare earth (RE) elements on the interfacial microstructures between Zn–Sn solder alloys and Cu substrate were also studied. The…
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Keywords:
interfacial reactions;
reactions zn20sn;
solder;
zn20sn solder ... See more keywords
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Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-01729-8
Abstract: The interfacial reactions between Cu and Al during ultrasonic welding were investigated, focusing on the effect of Pd in Pd-coated Cu and Pd-alloyed Cu (0.3 wt% and 2 wt% PdCu). For Pd-coated Cu–Al bonding, it…
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Keywords:
imcs;
interfacial reactions;
diffusion;
reactions ultrasonic ... See more keywords
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Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-02950-6
Abstract: The microelectronics packaging industry, although rapidly growing, faces several challenges including 3-D integration, issues with multifunctional capability, and fluctuating input/output (I/O) density, among others. Better-performing microelectronics assemblies for mitigating these challenges require alloys with superior…
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Keywords:
pure layers;
interfacial reactions;
pure;
pure joint ... See more keywords
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Published in 2019 at "JOM"
DOI: 10.1007/s11837-019-03625-2
Abstract: The liquid/solid interfacial reactions of Sn, Sn-(3.0 wt.% to 0.5 wt.%)Cu (SAC), and Sn-9.0 wt.%Zn (SZ) solders with Ni-xPd-yCo substrates at 240°C, 270°C, and 300°C for 0.5 h to 5 h have been investigated. The…
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Keywords:
xpd yco;
free solders;
reactions lead;
interfacial reactions ... See more keywords
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Published in 2020 at "JOM"
DOI: 10.1007/s11837-020-04288-0
Abstract: Liquid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric (TE) material with Sn and Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC305) solders, respectively, were examined at 250°C on a commercial highly orientated (Bi,Sb)2Te3 substrate with a (110) soldering plane. For the reactions…
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Keywords:
phase;
interfacial reactions;
liquid state;
snte ... See more keywords
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Published in 2017 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2016.12.101
Abstract: Abstract We report here on the results of a systematic investigation of the interfacial reactions and microstructural evolution of nanoscale Ni metal dots on N 2 + -implanted amorphous Si (a-Si) substrates under different annealing…
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Keywords:
interfacial reactions;
amorphous substrates;
microstructural evolution;
implanted amorphous ... See more keywords
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Published in 2020 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2019.144339
Abstract: Abstract Herein, we investigated the interfacial reactions of crystalline Pd (pure Pd) and amorphous Pd (Pd(P)) layers in thin electroless-Ni electroless-Pd immersion-Au (thin-ENEPIG) surface-finished printed circuit board with Sn-3.0Ag-0.5Cu (SAC305) solder joints reflowed at 260 °C…
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Keywords:
interfacial reactions;
pure;
0ag 5cu;
solder joints ... See more keywords
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Published in 2017 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2016.09.304
Abstract: Abstract Ag-Sb eutectic alloy is a potential braze for mid-temperature thermoelectric device, and Ni is frequently used as a barrier layer. This study attempts to generate information about Ag-Ni-Sb phase equilibria and Ag-Sb/Ni interfacial reactions…
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Keywords:
interfacial reactions;
phase equilibria;
350 550;
equilibria interfacial ... See more keywords
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Published in 2018 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2018.07.148
Abstract: Abstract P-type (Bi,Sb)2Te3 material system is extensively used in commercial thermoelectric (TE) applications. Soldering is commonly applied to fabricate bulk TE elements into TE modules. This study carefully examined the solid-state interfacial reactions of the…
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Keywords:
solid state;
snte snsb;
interfacial reactions;
type 2te3 ... See more keywords