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Published in 2024 at "Advanced Materials"
DOI: 10.1002/adma.202412137
Abstract: The increasing computing power of AI presents a major challenge for high‐power chip solution and heat dissipation. Boron nitride nanosheet‐based thermal interface materials (BNNS‐based TIMs) exhibit excellent electrical insulation property, ensuring the secure and stable…
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Keywords:
interfacial thermal;
boron nitride;
thermal transport;
surface functionalization ... See more keywords
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Published in 2019 at "Advanced Materials Interfaces"
DOI: 10.1002/admi.201900275
Abstract: Graphene–Bi2Te3, a graphene‐based compound with a metal/metalloid heterostructure, is recently discovered to be a potentially novel thermoelectric material, demonstrating unprecedently enhanced thermoelectric efficiencies. The interfacial thermal transport must play an important role in determining the…
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Keywords:
thermal contact;
heterostructure;
interfacial thermal;
graphene bi2te3 ... See more keywords
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Published in 2020 at "Advanced Materials Interfaces"
DOI: 10.1002/admi.202000364
Abstract: Extensive effort is dedicated to developing 2D materials as an alternative to Si‐based semiconductor technology. As the size decreases, heat dissipation at various interfaces becomes increasingly important in controlling device performance. On the other hand,…
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Keywords:
thermal electrical;
mos2 monolayer;
interfacial thermal;
conductance ... See more keywords
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Published in 2025 at "Advanced Electronic Materials"
DOI: 10.1002/aelm.202400931
Abstract: It has been a persistent challenge to experimentally distinguish the contribution of electron‐phonon coupling on interfacial thermal conductance from phonon‐dominated pathways. The LaAlO3/SrTiO3 (LAO/STO) interface offers a unique platform to address this, at which two‐dimensional…
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Keywords:
phonon;
electron phonon;
interfacial thermal;
thermal conductance ... See more keywords
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Published in 2025 at "Polymers for Advanced Technologies"
DOI: 10.1002/pat.70106
Abstract: Thermal interface materials are crucial for the thermal management of modern electronic devices. The thermal conductivity of polymer‐based composites, as the widely used thermal interface materials, is still limited by the high interfacial thermal resistance…
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Keywords:
thermal resistance;
carbon;
silicone;
interfacial thermal ... See more keywords
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Published in 2025 at "Small"
DOI: 10.1002/smll.202506551
Abstract: As a 2D material with distinctive ferroelectric properties, In2Se3 offers significant potential for the applications in information memory and advanced data storage technologies. It also exhibits a complex phase diagram that is highly sensitive to…
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Keywords:
tuning interfacial;
interfacial thermal;
thermal transport;
transport phase ... See more keywords
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Published in 2024 at "International Journal of Thermophysics"
DOI: 10.1007/s10765-023-03324-w
Abstract: The thermoreflectance technique is one of the few methods which can measure thermal diffusivity of thin films as thin as 100 nm or thinner in the cross-plane direction. The thermoreflectance method under rear-heat front-detect configuration…
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Keywords:
thermal resistance;
flash method;
resistance;
laser flash ... See more keywords
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Published in 2017 at "Nano Research"
DOI: 10.1007/s12274-017-1504-8
Abstract: Recent studies have indicated that two-dimensional (2D) MoS2 exhibits low in-plane and inter-plane thermal conductivities. This poses a significant challenge to heat management in MoS2-based electronic devices. To address this challenge, we have designed MoS2-graphene…
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Keywords:
interfacial thermal;
thermal conductance;
plane;
mos2 graphene ... See more keywords
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Published in 2020 at "Carbon"
DOI: 10.1016/j.carbon.2020.04.065
Abstract: To ensure reliable performance and lifetime of electronics, effective and efficient heat removal is essential, which relies heavily on the high thermal conductivity of the packaging substrates and thermal interface materials (TIMs). Highly conductive fillers…
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Keywords:
interfacial thermal;
carbon;
ultra thin;
carbon nanothreads ... See more keywords
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Published in 2018 at "Case Studies in Thermal Engineering"
DOI: 10.1016/j.csite.2018.06.005
Abstract: Abstract Colloidal suspensions of nanoparticles (nanofluids) are materials of interest for thermal engineering, because their heat transfer properties are typically enhanced as compared to the base fluid one. Effective medium theory provides popular models for…
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Keywords:
interfacial thermal;
conductivity nanofluids;
thermal conductivity;
thermal resistance ... See more keywords
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Published in 2020 at "International Journal of Heat and Mass Transfer"
DOI: 10.1016/j.ijheatmasstransfer.2020.119395
Abstract: Abstract Combining both vertical and in-plane two-dimensional (2D) heterostructures opens up the possibility to create an unprecedented architecture using 2D atomic layer building blocks. The thermal transport properties of such multilayer-mixed heterostructures, critical to various…
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Keywords:
plane;
transport properties;
thermal transport;
multilayer plane ... See more keywords