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Published in 2024 at "steel research international"
DOI: 10.1002/srin.202400419
Abstract: By adjusting the parameters in the additive manufacturing process, the optimization of the microstructure and mechanical properties of 2205 duplex stainless steel (DSS) is of great significance to ensure the reliability of the material in…
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Keywords:
interlayer cooling;
microstructure properties;
time;
cooling time ... See more keywords
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Published in 2018 at "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"
DOI: 10.1109/tcad.2017.2731683
Abstract: Interlayer liquid cooling network has been considered as one of the effective cooling mechanisms for heat dissipation in three dimensional integrated circuits (3D ICs). In this paper, an optimization approach is proposed for 3D IC…
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Keywords:
network design;
interlayer cooling;
cooling network;
design ... See more keywords