Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process
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DOI: 10.1016/j.jallcom.2017.06.218
Abstract: Abstract The grain morphology and mechanical strength of the high-melting-temperature intermetallic joints formed in the asymmetrical Ni/Sn/Cu system using a transient liquid phase (TLP) soldering process were investigated. The grain morphology of the (Cu, Ni)6Sn5… read more here.
Keywords: grain morphology; intermetallic joints; melting temperature;