A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
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DOI: 10.1016/j.intermet.2021.107342
Abstract: Abstract Three-dimensional integrated circuits provide a promising approach to extend Moore's law by vertically stacking multiple functional chips with microbumps. However, with miniaturization, depletion of the wetting layer of under bump metallurgy becomes a worrisome… read more here.
Keywords: wetting layer; terminal stage; intermetallics adhesion; adhesion layer ... See more keywords