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Published in 2019 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-019-06941-0
Abstract: In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at…
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Keywords:
interfacial intermetallics;
concentration interfacial;
liquid solid;
solder ... See more keywords