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Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.3033136
Abstract: Interposer-based 2.5-D integrated circuits (ICs) enable the chip-level reuse of hard intellectual properties (IPs), also known as chiplets. Such system-level integration shortens the design cycle considerably for large-scale and heterogeneous chips. Besides traditional interposers, which…
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Keywords:
interposer;
flow active;
active interposer;
design ... See more keywords