Effect of Invar particle size on microstructures and properties of the Cu/Invar bi-metal matrix composites fabricated by SPS
Sign Up to like & getrecommendations! Published in 2022 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2021.162055
Abstract: Abstract The Cu/Invar bi-metal matrix composites have a great potential to be used as novel electronic packaging materials. In order to clarify effects of the Invar particle size on microstructures and properties of the composites,… read more here.
Keywords: invar metal; invar particle; matrix composites; invar ... See more keywords
Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications
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DOI: 10.1109/jmems.2016.2624423
Abstract: Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor… read more here.
Keywords: invar metal; silicon vias; high temperature; vias invar ... See more keywords