Effects of etching conditions on surface morphology of periodic inverted trapezoidal patterned Si(100) substrate
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DOI: 10.1007/s11801-017-6242-3
Abstract: In this paper, the anisotropic etching process of Si(100) wafers in tetramethyl ammonium hydroxide (TMAH) solution with isopropyl alcohol (IPA) is investigated in detail. An inverted trapezoidal pattern is developed. A series of experiments are… read more here.
Keywords: inverted trapezoidal; microscopy; etching conditions; effects etching ... See more keywords