Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps
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DOI: 10.1007/s10854-017-8096-7
Abstract: Micron level Cu-pillar microbumps, which appear as the size of three-dimensional packaging shrinks down, have to introduce many unexpected reliability problems. The fast growth of intermetallic compounds (IMC) and voids tend to be a serious… read more here.
Keywords: voids growth; intermetallic compound; investigation intermetallic; growth fine ... See more keywords