Failure investigation of packaged SiC-diodes after thermal storage in extreme operating condition
Sign Up to like & getrecommendations! Published in 2018 at "Engineering Failure Analysis"
DOI: 10.1016/j.engfailanal.2017.09.010
Abstract: Abstract Ageing tests through thermal storage at high temperature (240 °C) are carried out on commercial Schottky diodes in TO220 package, in “derating mode” operational conditions. The analysis revealed a failure mechanism, resulting into vaporization of… read more here.
Keywords: thermal storage; investigation packaged; microscopy; failure investigation ... See more keywords