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Published in 2017 at "Scientific Reports"
DOI: 10.1038/s41598-017-15094-1
Abstract: Die-to-wafer heterogeneous integration of single-crystalline GaN film with CMOS compatible Si(100) substrate using the ion-cutting technique has been demonstrated. The thermodynamics of GaN surface blistering is in-situ investigated via a thermal-stage optical microscopy, which indicates…
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Keywords:
slicing gan;
thermodynamics;
ion slicing;
ion ... See more keywords