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Published in 2024 at "IEEE Electron Device Letters"
DOI: 10.1109/led.2024.3417708
Abstract: In this letter, a miniaturized high-selectivity bandpass filter with wide stopband is proposed based on through-glass-via (TGV) integrated passive device (IPD) technology. Four LC resonators are used to construct the filter, and each resonator can…
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Keywords:
filter;
selectivity;
ipd technology;
stopband ... See more keywords
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Published in 2023 at "Micromachines"
DOI: 10.3390/mi14050932
Abstract: Heterogeneous integration (HI) is a rapidly developing field aimed at achieving high-density integration and miniaturization of devices for complex practical radio frequency (RF) applications. In this study, we present the design and implementation of two…
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Keywords:
return loss;
ipd technology;
isolation return;
design implementation ... See more keywords
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Published in 2025 at "Micromachines"
DOI: 10.3390/mi16040443
Abstract: As integrated electronic microsystems advance, their internal components demonstrate increasing miniaturization, higher-density integration, and, consequently, significantly enhanced performance. This paper presents an on-chip transformer balun. The balun has a combination of planar coupled inductors and…
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Keywords:
chip balun;
ipd technology;
chip;
glass ... See more keywords