Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints
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DOI: 10.1016/j.jallcom.2016.12.131
Abstract: Abstract The influence of the joint size on the growth of intermetallic compound (IMC) between Sn-3.0Ag-0.5Cu-0.1TiO 2 composite solder and Cu pad during isothermal aging at temperatures of 100 °C, 120 °C, and 150 °C has been investigated… read more here.
Keywords: solder joints; joint size; size; solder ... See more keywords