Failures of Cu-Cu Joints under Temperature Cycling Tests
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DOI: 10.3390/ma15144944
Abstract: In this study, the failure mechanisms of Cu-Cu joints under thermal cycling were investigated. Two structures of dielectrics (PBO/underfill/PBO and SiO2) were employed to seal the joints. Stress gradients induced in the joints with the… read more here.
Keywords: joints temperature; stress; cycling; temperature cycling ... See more keywords