Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering
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DOI: 10.1016/j.jmapro.2021.02.003
Abstract: Abstract Cu-foam sheets with the thicknesses of 0.15 mm and 0.5 mm were utilized as strengthening structure to improve the performances of the Sn3.0Ag0.5Cu (SAC305)/Cu solder joints. The ultrasonic-assisted soldering was applied to manufacture the… read more here.
Keywords: solder joints; foam; sn3 0ag0; solder ... See more keywords