Thermomechanical Stress Distribution Analysis of Junction Box on Silicon Photovoltaic Modules Based on Finite Element Analysis
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Journal of Photovoltaics"
DOI: 10.1109/jphotov.2019.2940530
Abstract: The electrical failure associated with concentration of heat and thermomechanical stress inside junction boxes is one of the main failure modes of photovoltaic (PV) modules. Three types of potting junction boxes with partial 72 Si… read more here.
Keywords: thermomechanical stress; junction box; distribution; analysis ... See more keywords