Experimental investigation on the ultrasonically assisted single-sided lapping of monocrystalline SiC substrate
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DOI: 10.1016/j.jmapro.2019.06.008
Abstract: Abstract This paper studied the effect and optimization of ultrasonically assisted single-sided lapping for monocrystalline SiC wafer using grey relational analysis method. 27 experiments based on the Taguchi method of orthogonal arrays were performed to… read more here.
Keywords: monocrystalline sic; ultrasonically assisted; sided lapping; single sided ... See more keywords