First-Last: A Cost-Effective Adaptive Routing Solution for TSV-Based Three-Dimensional Networks-on-Chip
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DOI: 10.1109/tc.2018.2822269
Abstract: 3D integration opens up new opportunities for future multiprocessor chips by enabling fast and highly scalable 3D Network-on-Chip (NoC) topologies. However, in an aim to reduce the cost of Through-silicon via (TSV), partially vertically connected… read more here.
Keywords: first last; last cost; tsv; adaptive routing ... See more keywords