Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies
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DOI: 10.1007/s00542-021-05228-x
Abstract: 3D WLCSP with via last TSV and UV laser releasable temporary bonding technologies is an ideal scheme to meet the increasing high performance, low cost and small-form-factor requirements. In present paper, we demonstrate a thin… read more here.
Keywords: laser; temporary bonding; last tsv; via last ... See more keywords