Residue-Assisted Water Layer Build-Up Under Transient Climatic Conditions and Failure Occurrences in Electronics
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DOI: 10.1109/tcpmt.2020.3005933
Abstract: Electronic devices are exposed to a variety of climatic conditions worldwide. The day/night temperature fluctuations between the device interior and external conditions can lead to the formation of transient conditions within the enclosure that enhances… read more here.
Keywords: water; water layer; temperature; climatic conditions ... See more keywords