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1
Published in 2020 at "Solar Energy Materials and Solar Cells"
DOI: 10.1016/j.solmat.2020.110501
Abstract: Abstract By using the sacrificial layer (SL) etching, GaAs substrates are separated from III–V epi substrate//Si substrate junctions that are made by surface activated bonding (SAB) technologies. The post-bonding low-temperature (300- ∘ C) annealing plays…
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Keywords:
gaas substrates;
gaas;
post bonding;
sacrificial layer ... See more keywords
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2
Published in 2023 at "Chemistry of Materials"
DOI: 10.1021/acs.chemmater.2c02549
Abstract: Two-dimensional (2D) layered materials offer unique properties that make them attractive for continued scaling in electronic and optoelectronic device applications. Successful integration of 2D materials into semiconductor manufacturing requires high-volume and high-precision processes for deposition…
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Keywords:
atomic layer;
layer;
thermal atomic;
mos2 ... See more keywords
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Published in 2019 at "Journal of Physical Chemistry C"
DOI: 10.1021/acs.jpcc.9b06104
Abstract: The thermal atomic layer etching (ALE) of Al2O3 can be achieved using sequential fluorination and ligand-exchange reactions. Although previous investigations have characterized the etch rates and surface chemistry, no reports have identified the volatile etch…
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Keywords:
etch species;
atomic layer;
chemistry;
etch ... See more keywords
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Published in 2019 at "Journal of Materials Chemistry C"
DOI: 10.1039/c9tc00896a
Abstract: Single layer etching of h-BN is achieved using a two-step remote plasma process.
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Keywords:
hexagonal boron;
boron nitride;
layer etching;
single layer ... See more keywords
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1
Published in 2019 at "Applied Physics Letters"
DOI: 10.1063/1.5119033
Abstract: Atomic Layer Etching is performed on SiO2 samples cooled down to a very low temperature (below −100 °C). C4F8 gas flow is injected and molecules physisorb on the cooled surfaces. Etching is then carried out using…
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Keywords:
etching sio2;
c4f8;
microscopy;
atomic layer ... See more keywords
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Published in 2021 at "Physics of Plasmas"
DOI: 10.1063/5.0047811
Abstract: Atomic layer etching (ALE), a cyclic process of surface modification and removal of the modified layer, is an emerging damage-less etching technology for semiconductor fabrication with a feature size of less than 10 nm. Among the…
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Keywords:
atomic layer;
step;
physics;
layer etching ... See more keywords
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Published in 2019 at "Nanotechnology"
DOI: 10.1088/1361-6528/aaf521
Abstract: In this study, two Cr atomic layer etching (ALE) methods have been applied for the precise control of Cr etching. The first one involves O radical adsorption followed by Cl+ ion desorption (ALE with chemical…
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Keywords:
ion desorption;
atomic layer;
ion;
layer etching ... See more keywords
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0
Published in 2017 at "Journal of Vacuum Science and Technology"
DOI: 10.1116/1.4986945
Abstract: The authors report on the development and application of an atomic layer etching (ALE) procedure based on alternating exposures of trimethylaluminum and anhydrous hydrogen fluoride (HF) implemented to controllably etch aluminum oxide. The ALE process…
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Keywords:
enhanced atomic;
layer;
atomic layer;
aluminum oxide ... See more keywords
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Published in 2018 at "Journal of Vacuum Science and Technology"
DOI: 10.1116/1.5003393
Abstract: Plasma assisted atomic layer etching (ALE) has recently been introduced into manufacturing of 10 nm logic devices. This implementation of ALE is called directional ALE because ions transfer momentum to the etching surface during the removal…
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Keywords:
layer;
atomic layer;
sputtering theory;
directional ale ... See more keywords
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Published in 2020 at "Journal of Vacuum Science and Technology"
DOI: 10.1116/1.5138989
Abstract: The reaction mechanism of atomic layer etching (ALE) process of Co thin films using Cl2 gas and diketone organic precursor hexafluoroacetylacetone (Hfac) has been investigated. In operando XPS featuring a reaction chamber directly connected to…
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Keywords:
mechanism;
atomic layer;
mechanism atomic;
layer etching ... See more keywords
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2
Published in 2023 at "Materials"
DOI: 10.3390/ma16103611
Abstract: To fabricate miniature semiconductors of 10 nm or less, various process technologies have reached their physical limits, and new process technologies for miniaturization are required. In the etching process, problems such as surface damage and…
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Keywords:
etching using;
atomic layer;
layer etching;
radical generation ... See more keywords