Effects of an interfacial layer on stress relaxation mechanisms active in the Cu-Si thin film system during thermal cycling
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DOI: 10.1557/mrc.2020.6
Abstract: The authors report effects of placing a very thin metallic interlayer, such as W and Ni, in between the Cu film and the Si substrate on cyclic thermal stress-induced interfacial sliding and hillock growth in… read more here.
Keywords: layer stress; stress; interfacial sliding; effects interfacial ... See more keywords