Board-Level Ku-Band Power Amplifier: Design and Challenges
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DOI: 10.1080/03772063.2020.1742804
Abstract: This paper describes the challenges in the design of board-level Ku-band power amplifier (PA) using the hybrid-MIC technology. The selection of laminates, connectors, cables and RF components, such... read more here.
Keywords: power amplifier; band power; board level; level band ... See more keywords