Wafer-level micropackaging in thin film technology for RF MEMS applications
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DOI: 10.1007/s00542-017-3583-6
Abstract: In this work, a thin-film packaging was developed to be used for radio-frequency microelectromechanical system configurations. The fabricated packages are suspended membranes in the multilayer SixNy/aSi/SixNy on conductive coplanar waveguides (CPWs) of different length. Several… read more here.
Keywords: wafer level; film technology; level micropackaging; thin film ... See more keywords