Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous Integration
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DOI: 10.1109/ted.2019.2915332
Abstract: A low-temperature wafer-level polyimide/metal asymmetric hybrid bonding structure using Cu/Sn metal and low-curing temperature polyimide is proposed in this paper. The Cu/Sn and polyimide can be bonded simultaneously at 250 °C. An ultrathin nickel (Ni)… read more here.
Keywords: level polyimide; asymmetric wafer; integration; wafer level ... See more keywords