Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures
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DOI: 10.1007/s11664-020-08530-y
Abstract: Wafer-level solid liquid interdiffusion (SLID) bonding, also known as transient liquid-phase bonding, is becoming an increasingly attractive method for industrial usage since it can provide simultaneous formation of electrical interconnections and hermetic encapsulation for microelectromechanical… read more here.
Keywords: wafer level; liquid interdiffusion; formation; level solid ... See more keywords