Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization
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DOI: 10.3390/mi13060928
Abstract: This paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used… read more here.
Keywords: electric field; vacuum; level vacuum; vacuum packaged ... See more keywords