A Wafer-Level Vacuum-Packaged Vertical Resonant Electric Field Microsensor
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DOI: 10.1109/ted.2023.3331335
Abstract: This article presents a wafer-level vacuum-packaged vertical resonant electric field microsensor (EFM), which uses an anodic bonded glass in silicon, silicon on insulator, and glass on silicon (GIS–SOI–GOS) triple-stack structure. GIS is innovatively employed to… read more here.
Keywords: vacuum; level vacuum; electric field; microsensor ... See more keywords
Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization
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DOI: 10.3390/mi13060928
Abstract: This paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used… read more here.
Keywords: electric field; vacuum; level vacuum; vacuum packaged ... See more keywords
Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors
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DOI: 10.3390/mi15080935
Abstract: This paper introduces a cost-effective, high-performance approach to achieving wafer level vacuum packaging (WLVP) for MEMS-based uncooled infrared sensors. Reliable and hermetic packages for MEMS devices are achieved using a cap wafer that is formed… read more here.
Keywords: vacuum; level vacuum; wafer level; mems based ... See more keywords