The effect of tricyclazole as a novel leveler for filling electroplated copper microvias
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electroanalytical Chemistry"
DOI: 10.1016/j.jelechem.2018.08.042
Abstract: Abstract Tricyclazole (TCA), a nitrogen-containing heterocyclic compound, is employed as potential leveler for microvia filling with electroplating copper. The leveler is characterized by quantum chemical calculations, molecular dynamics simulations, electrochemical measurements, Field-Emission Scanning Electron Microscope… read more here.
Keywords: leveler; copper; leveler filling; tca ... See more keywords
Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding
Sign Up to like & getrecommendations! Published in 2024 at "Materials"
DOI: 10.3390/ma17225405
Abstract: With the advancement of high-integration and high-density interconnection in chip manufacturing and packaging, Cu bumping technology in wafer- and panel- level packaging is developed to micrometer-sized structures and pitches to accommodate increased I/O numbers on… read more here.
Keywords: effect; solder joint; solder; pillar electroplating ... See more keywords
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
Sign Up to like & getrecommendations! Published in 2023 at "Molecules"
DOI: 10.3390/molecules28062783
Abstract: Levelers, as an essential part of organic additives in copper electroplating, play a crucial role in the fabrication of sophisticated interconnects in integrated circuits, packaging substrates, and printed circuit boards. In this work, four N-heterocyclic… read more here.
Keywords: performance correlation; copper; structure performance; leveler ... See more keywords