The effect of tricyclazole as a novel leveler for filling electroplated copper microvias
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DOI: 10.1016/j.jelechem.2018.08.042
Abstract: Abstract Tricyclazole (TCA), a nitrogen-containing heterocyclic compound, is employed as potential leveler for microvia filling with electroplating copper. The leveler is characterized by quantum chemical calculations, molecular dynamics simulations, electrochemical measurements, Field-Emission Scanning Electron Microscope… read more here.
Keywords: leveler; copper; leveler filling; tca ... See more keywords